Designing capacity
| Core technology | Detailed specifications | Technologies we acquired in 2018 | Technologies we acquired in 2019 | |
|---|---|---|---|---|
| Capacity to implement circuits | Materials :9um , 1/4oz | 50um / 50um | 40um / 40um | |
| Etching Process | Etching Process | Etching Process | ||
| Via Hole | Hole Size / Land | Through Hole | 100um / 300um | 75um / 250um |
| Laser Via Hole | 75um / 200um | 50um / 200um | ||
| LAYER composition | Multi-Layer | 8 LAYER | 10 LAYER | |
| Rigid-Flex | 8 LAYER | 10 LAYER | ||
| Raw materials | Copper Thickness | 1/4oz( ED / RA ) | 1/5oz( ED / RA ) | |
Status of Research Center
6 researchers specializing in designing are conducting research (more than 11 years in research) Possess 3D and XRF measurement technologies Possess labs to conduct various tests such as reliability, etc. Possess LASER devices for research and development Investing KRW 1.2 billion annually (3.9% of the sales)