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Technologies under Research

01Cutting process

Process to cut raw materials (FCCL, Coverlay, Bonding Sheet, Prepreg, Copper foil) in rolled state into working size

02CNC process

Process of processing through hole and laser via hole in base raw material for interlayer conduction

03Plating copper process

The process of conducting chemical or electroplating to the non-conductive part of the processed hole (Through hole & Laser via hole)

04D / F adhesion process

Process of adhering photosensitive film to form circuit on copper plated product

05Exposure process

Process of irradiating UV on the adhered photosensitive film

06D.E.S process

The process of forming a circuit by corroding copper by passing through a line consisting of development, corrosion and peeling

07AOI process

The process of inspecting circuit sections after scanning with automatic optical inspection equipment

08Tack Welding process

The process of melting cover-lay adhesive with an iron and attaching it temporarily with a base substrate

09Hot press process

Process of thermocompression bonding at high temperature and high pressure to completely cure the welded product

10Plating surface process

Process of plating the surface of copper foil exposed to cover-lay open section

11Automatic welding process

Automatic welding: Process to attach reinforcing bars (Epoxy, Kapton, Sus) for reinforcement in FPCB flexible section

12Post-processing

Process of processing guide hole for mold processing.

13BBT process

Process to detect open and short between circuits using electrical characteristics

14Press process

The process of processing the external appearance of the product through the press equipment and the mold.

15Inspection process

The process of determining suitability for appearance and dimensions of the finished product through appearance processing.